Method of forming semiconductor device including trimmed-gates

ABSTRACT

A method (of manufacturing a semiconductor device) includes: forming active regions including spacing apart neighboring active regions resulting in corresponding gaps; forming gate structures (overlying the active regions and the gaps) including locating intra-gap segments of the gate structures over the gaps, arranging each intra-gap segment to include two end regions separated by a central region, and at intersections between active regions and gate structures that is designated to be non-functional (flyover intersection), preventing formation of a functional connection between the two; and removing selected portions of at least some of the intra-gap segments including removing central regions of first selected intra-gap segments substantially without removing portions of corresponding end regions of the first selected intra-gap segments, and removing central regions and portions of end regions of second selected intra-gap segments for which corresponding end regions of the second intra-gap segments abut flyover intersections thereby trimming corresponding gate structures.

PRIORITY CLAIM

The present application is a continuation of U.S. application Ser. No.16/512,175, filed Jul. 15, 2019, which is a divisional of U.S.application Ser. No. 15/729,307, filed Oct. 10, 2017, now U.S. Pat. No.10,373,962, issued Aug. 6, 2019, which claims the priority of U.S.Provisional Application No. 62/511,488, filed May 26, 2017, which areincorporated herein by reference in their entireties.

BACKGROUND

An integrated circuit (“IC”) includes one or more semiconductor devices.As electronic devices/components of semiconductor devices decrease insize, the spacing between such electronic devices/components similarlydecreases in size. As such spacing decreases, the resistance to leakagecurrent between neighboring components also decreases.

One way in which to represent a semiconductor device is with a plan viewdiagram referred to as a layout diagram. A designer of a layout diagramconfigures the layout diagram by taking into consideration, among otherthings, separation distances achievable between such electronicdevices/components.

BRIEF DESCRIPTION OF THE DRAWINGS

One or more embodiments are illustrated by way of example, and not bylimitation, in the figures of the accompanying drawings, whereinelements having the same reference numeral designations represent likeelements throughout. The drawings are not to scale, unless otherwisedisclosed.

FIG. 1A is a block diagram of a semiconductor device, in accordance withat least one embodiment of the present disclosure.

FIG. 1B is a layout diagram of a trimmed-gates region of a semiconductordevice, in accordance with at least one embodiment of the presentdisclosure.

FIG. 2A is a layout diagram of a trimmed-gates region of a semiconductordevice, in accordance with some embodiments.

FIG. 2B is a layout diagram of a trimmed-gates region of a semiconductordevice, in accordance with some embodiments.

FIG. 3A is a flowchart of a method of generating a layout of asemiconductor device, in accordance with some embodiments.

FIG. 3B is a more detailed view of a block in FIG. 3A, in accordancewith at least one embodiment of the present disclosure.

FIG. 3C is a more detailed view of a block in FIG. 3B, in accordancewith at least one embodiment of the present disclosure.

FIG. 3D is a more detailed view of a block in FIG. 3A, in accordancewith at least one embodiment of the present disclosure.

FIG. 3E is a more detailed view of a block in FIG. 3D, in accordancewith at least one embodiment of the present disclosure.

FIG. 3F is a more detailed view of a block in FIG. 3A, in accordancewith at least one embodiment of the present disclosure.

FIG. 3G is a more detailed view of a block in FIG. 3A, in accordancewith at least one embodiment of the present disclosure.

FIG. 4 is a block diagram of an electronic design automation (EDA)system, in accordance with at least one embodiment of the presentdisclosure.

FIG. 5 is a block diagram of an integrated circuit (IC) manufacturingsystem, and an IC manufacturing flow associated therewith, in accordancewith at least one embodiment of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components, materials, values, steps,operations, materials, arrangements, or the like, are described below tosimplify the present disclosure. These are, of course, merely examplesand are not intended to be limiting. Other components, values,operations, materials, arrangements, or the like, are contemplated. Forexample, the formation of a first feature over or on a second feature inthe description that follows may include embodiments in which the firstand second features are formed in direct contact, and may also includeembodiments in which additional features may be formed between the firstand second features, such that the first and second features may not bein direct contact. In addition, the present disclosure may repeatreference numerals and/or letters in the various examples. Thisrepetition is for the purpose of simplicity and clarity and does not initself dictate a relationship between the various embodiments and/orconfigurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

For a flyover type of intersection (in which a gate electrode crossesthe underlying active region), the gate electrode is NOT functionallyconnected to the corresponding underlying active region. Whereas thegate electrode for a functional type of intersection (at which the gateelectrode IS functionally connected to the corresponding underlyingactive region) extends into a gap adjacent the flyover intersection, itis recognized that the gate electrode for a flyover intersection doesnot need to extend into a gap adjacent the flyover intersection.Accordingly, for a flyover intersection, the extension of the gateelectrode (that otherwise would have been present) is eliminated by theinclusion of additional cut-patterns adjacent the flyover intersection,thereby trimming the gate electrode. A result is a larger gap betweenthe corresponding portion of the active region and a neighboringstructure, e.g., a circuit. Compared to the smaller gap that otherwisewould have been present if the extension of the gate electrode wouldhave been present, the larger gap more strongly resists leakage currentbetween the neighboring structure and the corresponding gate electrodehaving the flyover intersection, which reduces (and thus improves) anintra/inter layer “ON” state gate leakage of the semiconductor devicewhich includes such a trimmed-gates region.

FIG. 1A is a block diagram of a semiconductor device 100, in accordancewith at least one embodiment of the present disclosure.

In FIG. 1A, semiconductor device 100 includes, among other things, acircuit macro/module 101. In some embodiments, circuit macro/module 101is understood in the context of an analogy to the architecturalhierarchy of modular programming in which subroutines/procedures arecalled by a main program (or by other subroutines) to carry out a givencomputational function. In this context, semiconductor device 100 usescircuit macro/module 101 to form one or more given functions.Accordingly, in this context and in terms of architectural hierarchy,semiconductor device 100 is analogous to the main program and circuitmacro/module (hereinafter, macro) 101 is analogous tosubroutines/procedures. In some embodiments, macro 101 is a soft macro.In some embodiments, macro 101 is a hard macro. In some embodiments,macro 101 is a soft macro which is described/couched inregister-transfer level (RTL) code. In some embodiments, synthesis,placement and routing have yet to have been performed on macro 101 suchthat the soft macro can be synthesized, placed and routed for a varietyof process nodes. In some embodiments, macro 101 is a hard macro whichis described/couched in a binary file format (e.g., Graphic DatabaseSystem II (GDSII) stream format), where the binary file formatrepresents planar geometric shapes, text labels, other information andthe like of one or more layout diagrams of macro 101 in hierarchicalform. In some embodiments, synthesis, placement and routing have beenperformed on macro 101 such that the hard macro is specific to aparticular process node.

In some embodiments, macro 101 is an SRAM macro. In some embodiments,macro 101 is another macro such as another type of RAM, a ROM, phaselock loops (PLLs), special function circuits, or the like. Macro 101includes, among other things, a trimmed-gates region 102. In someembodiments, region 102 corresponds to a part of or an entirety of aninstance of a standard cell structure, where the standard cell structureis included in a library of various standard cell structures.

FIG. 1B is a layout diagram of a trimmed-gates region 102 of asemiconductor device, in accordance with at least one embodiment of thepresent disclosure. In some embodiments, the semiconductor device issemiconductor device 100 of FIG. 1.

There are at least two types of layout diagrams. A first (or ‘pre-cut’)type of layout diagram represents inchoate structures and corresponding‘cut’ regions. FIGS. 2A-2B (discussed below) are examples of a pre-cutlayout diagram. A second (or ‘post-cut’) type of layout diagramrepresents the structures resulting from the corresponding pre-cutlayout diagram. FIG. 1B is an example of a post-cut layout diagram.Regarding the pre-cut layout diagram, an inchoate version of a structurerefers to a version of the structure which is not yet completed or fullydeveloped. A cut region of a pre-cut layout diagram indicates that aportion of a corresponding structure underlying the cut region will beremoved (or cut). Here, because a portion of a given structure whichunderlies a corresponding cut region will be removed (or cut), the givenstructure is not yet completed or fully developed, and so the givenstructure is referred to herein as an inchoate structure.

In FIG. 1B, active areas 108A-108B are formed as substantiallyrectangular shapes disposed on and/or over a substrate 106, where longaxes of active areas 108A-108B are substantially parallel to a firstdirection. The phrase “substantially parallel” should be understood inthe context of variations which result from manufacturingprocess-tolerances. Active areas 108A-108B are separated by a gap 118A,relative to a second direction, where the second direction issubstantially perpendicular to the first direction. The phrase“substantially perpendicular” should be understood in the context ofvariations which result from manufacturing process-tolerances. Gateelectrodes 112A′, 112A″, 112B′, 112B″, 112C′, 112C″, 112D′ and 112D″ areformed as substantially rectangular shapes over corresponding activeareas 108A-108B, where long axes of gate electrodes 112A′, 112A″, 112B′,112B″, 112C′, 112C″, 112D′ and 112D″ are substantially parallel to thesecond direction. In a gap 118B which separates gate electrodes 112A′,112B′, 112C′ and 112D′ and corresponding gate electrodes 112A″, 112B″,112C″ and 112D″, relative to the second direction, a structure 130 isformed on and/or over a substrate 106. In some embodiments, structure130 includes at least some components of a circuit. In some embodiments,structure 130 includes at least a portion of a power rail/strap, e.g.,VDD, VSS or the like.

As noted, active areas 108A-108B are formed as substantially rectangularshapes. In some embodiments, active areas 108A-108B have other shapes.For simplicity of illustration, FIG. 1B shows two active areas, namely108A-108B. In some embodiments, greater numbers of active areas areprovided. Active areas 108A-108B are arranged relative to a first grid103A which is imaginary and which includes parallel first referencelines/tracks 103B which are imaginary and which lie parallel to thefirst direction. In FIG. 1B, the first direction is the horizontaldirection. In some embodiments, the first direction is a direction otherthan the horizontal direction.

In some embodiments, active areas 108A-108B are configured for NMOStechnology. In some embodiments, active areas 108A-108B are configuredfor PMOS technology. In some embodiments, active area 108A is configuredfor NMOS technology and active area 108B is configured for PMOStechnology. In some embodiments, active area 108A is configured for PMOStechnology and active area 108B is configured for NMOS technology. Insome embodiments, active areas 108A-108B are configured for planar FETtechnology. In some embodiments, active areas 108A-108B are configuredfor finFET technology. Where configured for finFET technology, activeareas 108A-108B include instances of fins (not shown) arrangedsubstantially at least parallel to, if not collinearly with respect to,corresponding ones of first reference lines/tracks 103B, and thus aresubstantially parallel to the horizontal direction. The fins may bepatterned by any suitable method. For example, the fins may be patternedusing one or more photolithography processes, includingdouble-patterning or multi-patterning processes. Generally,double-patterning or multi-patterning processes combine photolithographyand self-aligned processes, allowing patterns to be created that have,for example, pitches smaller than what is otherwise obtainable using asingle, direct photolithography process. For example, in one embodiment,a sacrificial layer is formed over a substrate and patterned using aphotolithography process. Spacers are formed alongside the patternedsacrificial layer using a self-aligned process. The sacrificial layer isthen removed, and the remaining spacers may then be used to pattern thefins. Additional details regarding the structure and manufacture of CMOSfinFET technology are disclosed in commonly assigned U.S. Pat. No.8,786,019, granted Jul. 22, 2014, the entirety of which is herebyincorporated by reference.

In some embodiments, active areas are configured into one or moreinstances of a first row which are interleaved with one or moreinstances of a second row. Each instance of the first row and of thesecond row is arranged to be substantially parallel to the firstdirection. Each instance of the first row and of the second row includesa predetermined number of the first reference lines/tracks 103B. In someembodiments, instances of the first row have a first conductivity andinstances of the second row have a second conductivity. In someembodiments, instances of the first row are configured for PMOStechnology and instances of the second row are configured for NMOStechnology. In some embodiments, instances of the first row areconfigured for NMOS technology and instances of the second row areconfigured for PMOS technology.

As noted, gate electrodes 112A′, 112A″, 112B′, 112B″, 112C′, 112C″,112D′ and 112D″ are formed as substantially rectangular shapes. In someembodiments, gate electrodes 112A′, 112A″, 112B′, 112B″, 112C′, 112C″,112D′ and 112D″ have other shapes. For simplicity of illustration, FIG.1B shows eight gate electrodes, namely 112A′, 112A″, 112B′, 112B″,112C′, 112C″, 112D′ and 112D″. In some embodiments, fewer or greaternumbers of gate electrodes are provided. Gate electrodes 112A′, 112A″,112B′, 112B″, 112C′, 112C″, 112D′ and 112D″ are arranged relative to asecond grid 103C which is imaginary and which further includes parallelsecond reference lines/tracks 103D which are imaginary and which lieparallel to the second direction. In some embodiments, the seconddirection is the vertical direction.

Where gate electrodes 112A′, 112A″, 112B′, 112B″, 112C′, 112C″, 112D′and 112D″ cross over corresponding portions of active areas 108A-108B,two types of intersections are described, namely a functionalintersection 114A and a flyover intersection 114B. For functionalintersection 114A, the gate electrode is functionally connected to thecorresponding underlying active region, and so extends bilaterally inthe vertical direction from the corresponding underlying active regionincluding extending substantially into gap 118A. For flyoverintersection 114B, the gate electrode is NOT functionally connected tothe corresponding underlying active region, and so extends at mostunilaterally in the vertical direction from the corresponding underlyingactive region, but does not extend substantially into gap 118A. In someembodiments, flyover intersection 114B results from a circumstance inwhich the gate electrode is a dummy gate electrode. In some embodiments,flyover intersection 114B results from a circumstance in which theportion of the gate electrode which crosses over the active area servesas an interconnect type of conductor for structures other than theactive area. In FIG. 1B: gate electrodes 112A′, 112C′ and 112D′ arearranged to cross over active area 108A with corresponding instances offunctional intersection 114A; gate electrode 112B′ is arranged to crossover active area 108A with an instance of flyover intersection 114B;gate electrodes 112A″, 112B″ and 112D″ are arranged to cross over activearea 108B with corresponding instances of functional intersection 114A;and gate electrode 112C″ is arranged to cross over active area 108B withan instance of flyover intersection 114B.

For functional intersections 114A, relative to the vertical direction,the corresponding gate electrode extends a predetermineddistance/height, H_(EXT), into gap 118A such that the extension of thegate electrode (“gate-extension”) terminates at the edge of gap 118B. Inparticular, gate electrodes 112A′, 112C′ and 112D′ include correspondinggate-extensions 120A′, 120C′ and 120D′, and gate electrodes 112A″, 112B″and 112D″ include corresponding gate-extensions 120A″, 120B″ and 120D″.In some embodiments, the extension of the gate electrode is provided tofacilitate the functional connection between the gate electrode and thecorresponding underlying active region. In some embodiments, the heightH_(EXT) in the vertical direction of the gate-extension is less than orequal to about a three times multiple of a width, W_(G), in thehorizontal direction of the gate electrode, wherein:

H _(EXT)≤(≈3W _(G))

For flyover intersections 114B, relative to the vertical direction, thecorresponding gate electrode does not extend substantially into gap118A, where the phrase “does not extend substantially into” should beunderstood in the context of variations which result from manufacturingprocess-tolerances. In particular, there are gaps 124B′ and 124C″between structure 130 and corresponding gate electrodes 112B′ and 112C″.Gaps 124B′ and 124C″ increase vertical separation between structure 130and corresponding gate electrodes 112B′ and 112C″. Consequently, gaps124B′ and 124C″ increase corresponding resistances to leakage currentbetween structure 130 and corresponding gate electrodes 112B′ and 112C″,which reduces (and thus improves) an intra/inter layer “ON” state gateleakage of the semiconductor device which includes trimmed-gates region102.

FIG. 2A is a layout diagram 202A of a trimmed-gates region of asemiconductor device, in accordance with some embodiments. In someembodiments, a trimmed-gates region of a semiconductor device which willbe produced from layout diagram 202A is trimmed-gates region 102 of FIG.1B. As such, FIG. 2A is similar to FIG. 1B. Accordingly, relative toFIG. 1B, the numbering of similar objects in FIG. 2A is increased by100.

In FIG. 2A, active area (“AR”) patterns 208A-208B are generated assubstantially rectangular shapes which are disposed on and/or over asurface 206, where surface 206 represents substrate 106, and where longaxes of AR patterns 208A-208B are substantially parallel to the firstdirection. In FIG. 2A, the first direction is the horizontal direction.In some embodiments, the first direction is a direction other than thehorizontal direction. Active regions 108A-108B are examples of activeregions resulting from AR patterns 208A-208B. AR patterns 208A-208B areseparated by a gap 218A, relative to the second direction. Gate patterns212A, 212B, 212C and 212D are generated as substantially rectangularshapes which are disposed over corresponding AR patterns 208A-208B,where long axes of gate patterns 212A, 212B, 212C and 212D aresubstantially parallel to the second direction. After the effects ofcut-patterns (see discussion below) are taken into consideration, gateelectrodes 112A′, 112A″, 112B′, 112B″, 112C′, 112C″, 112D′ and 112D″ areexamples of gate electrodes resulting from corresponding gate patterns212A, 212B, 212C and 212D.

Depending upon the semiconductor device(s) which is intended to beproduced based at least in part on layout diagram 202A, one or moreportions of one or more of gate patterns 212A-212D eventually will beremoved/cut. An instance of a cut pattern is used to indicate one ormore portions of corresponding one or more gate patterns 212A-212D whicheventually will be removed/cut. For simplicity of illustration, FIG. 2Ashows three cut patterns.

To produce a gap 218B, a cut-pattern 216 is generated as a substantiallyrectangular shape which is disposed on gate patterns 212A-212D, where along axis of cut-pattern 216 is substantially parallel to the firstdirection. In some embodiments, cut-pattern 216 has other shapes. Insome embodiments, multiple cut patterns are provided which, in theaggregate, result in substantially the same amounts of gate patterns212A-212D being removed as would be removed by cut-pattern 216, wherethe phrase “substantially the same” should be understood in the contextof variations which result from manufacturing process-tolerances.

Each of gate patterns 212A, 212B, 212C and 212D includes an intra-gapsegment 213W which lies over (“overlies”) gap 218A. Each intra-gapsegment 213W includes a central region 213X and two end regions 213Y and213Z. For each intra-gap segment 213W: midlines of central region 213Xand of gap 218 are substantially aligned in the vertical direction,where the phrase “substantially aligned” should be understood in thecontext of variations which result from manufacturingprocess-tolerances; central region 213X has a height in the verticaldirection which is substantially the same as the height in the verticaldirection of gap 218B; end region 213Y extends between central region213X and AR pattern 208A; and end region 213Z extends between centralregion 213X and AR pattern 208A. In FIG. 2A, a midline of a structure isoriented perpendicularly to the long axis of the structure. By contrast,a centerline of a structure is oriented parallel to the long axis of thestructure.

Depending also upon the semiconductor device(s) which is intended to beproduced based at least in part on layout diagram 202A, either afunctional intersection 214A or a flyover intersection 214B is arrangedat each instance where gate patterns 212A-212D cross over correspondingportions of AR patterns 208A-208B. In FIG. 2B: gate patterns 212A, 212Cand 212D are arranged to cross over AR 208A with corresponding instancesof functional intersection 214A; gate pattern 212B is arranged to crossover AR 208A with an instance of flyover intersection 214B; gatepatterns 212A, 212B and 212D are arranged to cross over AR 208B withcorresponding instances of functional intersection 214A; and gatepattern 212C is arranged to cross over AR 208B with an instance offlyover intersection 214B.

For functional intersections 214A, after the effects of cut-pattern 216are taken into consideration and relative to the vertical direction, agate electrode resulting from the corresponding gate pattern will extenda predetermined distance/height, H_(EXT), into gap 218A such that theextension of the gate electrode (“gate-extension”) terminates at theedge of gap 218B, where gap 218B results from cut-pattern 216. Inparticular, gate electrodes 112A′ and 112A″ resulting from gate pattern212A include corresponding gate-extensions 120A′ and 120A″. Gateelectrode 112B″ resulting from gate pattern 212B includes gate-extension120B″. Gate electrode 112C′ resulting from gate pattern 212C includesgate-extension 120C′. Gate electrodes 112D′ and 112D″ resulting fromgate pattern 212D include corresponding gate-extensions 120D′ and 120D″.

Determination of the height in the vertical direction of cut-pattern 216sets the height of central regions 231X of intra-gap segments 2213W ofgate patterns 212A-212D, and consequently sets the heights in thevertical direction of end regions 213Y and 213Z of intra-gap segments213W. In particular, the height of cut-pattern 216 is set so that, forcorresponding ones of end regions 213Y and 213Z, which abut functionalintersections 214A, a consequential height of end regions 213Y and 213Zis sufficient to ensure that gate electrodes resulting fromcorresponding gate patterns 212A-212D will extend a predetermineddistance in the second direction beyond functional intersections 214A.In some embodiments, relative to the vertical direction, cut-pattern 130is sized and disposed between AR patterns 208A-208B such that theheight, H_(EXT), in the vertical direction of the resultantgate-extensions is less than or equal to about a three times multiple ofa width, W_(G), in the horizontal direction of the gate pattern,wherein:

H _(EXT)≤(≈3W _(G)).

For flyover intersections 214B, after the effects of cut-patterns(discussed above, and further discussed below) are taken intoconsideration and relative to the vertical, the corresponding gatepattern substantially will not extend into gap 218A. To prevent aresulting gate from extending into gap 218A, cut-patterns 222B and 222Care generated as substantially rectangular shapes which are disposed oncorresponding gate patterns 212B-212C, where a long axis of cut-patterns222B-222C are substantially parallel to the first direction. In someembodiments, cut-patterns 222B-222C have other shapes. In someembodiments, multiple cut patterns are provided which, in the aggregate,result in substantially the same amounts of gate patterns 212B-212Cbeing removed as would be removed by corresponding cut-patterns222B-222C. Gaps 124B′ and 124C″ are examples of gaps resulting fromcorresponding cut-patterns 222B-222C. In some embodiments, the width,W_(CP2), in the horizontal direction of cut-patterns 222B-222C is set tobe sufficiently wide so that an alignment-tolerance in the horizontaldirection of cut-patterns 222B-222C is comparable to the alignmenttolerance of cut-pattern 216. In some embodiments, the width W_(CP2) ofcut-patterns 222B-222C is set to be wider than a width, W_(G), of gatepatterns 212B-212C. In some embodiments, the width W_(CP2) ofcut-patterns 222B-222C is set to be less than or equal to about a 12times multiple of a width W_(G) of gate patterns 212B-212C, wherein:

W _(CP2)≤(≈12W _(G))

FIG. 2B is a layout diagram 202B of a trimmed-gates region of asemiconductor device, in accordance with some embodiments. In someembodiments, a trimmed-gates region of a semiconductor device which willbe produced from layout diagram 202A is trimmed-gates region 102 of FIG.1B.

Layout diagram 202B is a version of layout diagram 202A of FIG. 2A,where layout diagram 202B shows the results of cut-patterns 216 and222B-222C. As such, FIG. 2B is similar to FIG. 2A. Accordingly, FIG. 2Afollows the ‘two-series’ numbering scheme of FIG. 2A. Though FIG. 2Bshows the results of cut-patterns 216 and 222B-222C, nevertheless FIG.2B still shows patterns rather than structures resulting from suchpatterns, hence FIG. 2B is a pre-cut layout diagram rather than apost-cut layout diagram.

In FIG. 2B, gap 218B results from cut-pattern 216. Gaps 124B′ and 124C″result from corresponding cut-patterns 222B and 222C. Also, as a resultof cut-patterns 216, 222B and 222C: gate pattern 212A is divided andreduced to residual gate patterns 212A′ and 212A″; gate pattern 212B isdivided and reduced to residual gate patterns 212B′ and 212B″; gatepattern 212C is divided and reduced to residual gate patterns 212C′ and212C″; and gate pattern 212D is divided and reduced to residual gatepatterns 212D′ and 212D″. Again, at flyover intersection 214B where thegate electrode resulting from gate pattern 212B′ crosses the activeregion resulting from AR pattern 208A, the extension of the gateelectrode that otherwise would be present is eliminated by the inclusionof cut-pattern 222B in FIG. 2A, which results in gap 124B′ in FIG. 2B.Also, at flyover intersection 214B where the gate electrode resultingfrom gate pattern 212C″ crosses the active region resulting from ARpattern 208B, the extension of the gate electrode that otherwise wouldbe present is eliminated by the inclusion of cut-pattern 222C in FIG.2A, which results in gap 124C″ in FIG. 2B.

FIG. 3A is a flowchart of a method 300 of generating a layout of asemiconductor device, in accordance with some embodiments. In someembodiments, method 300 is used to generate an instance of layoutdiagram 202A of a trimmed-gates region 102 of a semiconductor device.

In FIG. 3A, the flowchart of method 300 includes blocks 302-310. Atleast one of blocks 302, 304, 306 or 308 is executed by a processor of acomputer. An example of the processor is a processor 402 of FIG. 4(discussed below). An example of the computer is an electronic designautomation (EDA) system 400 of FIG. 4 (discussed below). In someembodiments, each of blocks 302-308 is executed by the processor of thecomputer. In some embodiments, the layout generated by method 300 isstored on a non-transitory computer-readable medium. An example of thenon-transitory computer-readable medium is layout 407 of FIG. 4(discussed below).

At a block 302 of FIG. 3, AR patterns are generated for the layout. TheAR patterns are arranged in a first grid oriented parallel to a firstdirection. An example of the first grid is grid 103A of FIG. 2A, and anexample of the first direction is the horizontal direction. Examples ofthe AR patterns are AR patterns 208A-208B of FIG. 2A. From block 302,flow proceeds to a block 304. At block 304, gate patterns are generatedfor the layout. The gate patterns are arranged spaced apart in a secondgrid and overlie corresponding ones of the AR patterns. The second gridis oriented parallel to a second direction, where the second directionis orthogonal to the first direction. An example of the second grid isgrid 103C of FIG. 2A, and an example of the second direction is thevertical direction. Examples of the gate patterns are gate patterns212A-212D of FIG. 2A. Gaps, which are interspersed between neighboringones of the AR patterns, are overlied by corresponding intra-gapsegments of the gate patterns. Each intra-gap segment includes two endregions separated by a central region. Examples of the intra-gapsegments are intra-gap segments 213W of FIG. 2A. As such, examples ofthe central regions are central regions 213X, and examples of endregions are corresponding end regions 231Y and 213Z. From block 304,flow proceeds to a block 306.

At block 306, first cut-patterns are generated which overlie the centralregions of first selected ones of the intra-gap segments. Examples ofthe first cut-patterns are instances of cut-pattern 216 of FIG. 2A. Fromblock 306, flow proceeds to a block 308. At block 308, secondcut-patterns are generated which overlie the end regions of secondselected ones of the intra-gap segments which abut flyoverintersections, thereby trimming the corresponding gate patterns.Examples of the second cut-patterns are cut-patterns 222B and 222C ofFIG. 2A. Again, cut-pattern 222B abuts flyover intersection 214B wherethe gate electrode resulting from gate pattern 212B′ crosses the activeregion resulting from AR pattern 208A. Also, again, cut pattern 222Cabuts flyover intersection 214B where the gate electrode resulting fromgate pattern 212C″ crosses the active region resulting from AR pattern208B. From block 308, flow proceeds to a block 310. At block 310, basedon the layout, at least one of (A) one or more semiconductor masks isfabricated (see FIG. 5, discussed below) or (B) at least one componentin a layer of an inchoate semiconductor integrated circuit is fabricated(again, see FIG. 5, discussed below).

FIG. 3B is a more detailed view of block 306 of FIG. 3A, in accordancewith at least one embodiment of the present disclosure.

In FIG. 3B, block 306 includes a block 320. At block 320, the height ofthe first cut-patterns is set. Each gap, central region and end regionhas a corresponding height in the second direction. Determination of theheight of the first cut-patterns sets the height of the central regionsof the intra-gap segments of the gate patterns and consequently sets theheights of end regions of the intra-gap segments of the gate patterns.In particular, the height of the first cut-patterns is set so that, forcorresponding ones of the end regions of the intra-gap segments whichabut functional intersections, a consequential height of the end regionsis sufficient to ensure that gate electrodes resulting fromcorresponding gate patterns will extend a predetermined distance in thesecond direction beyond the functional intersections. Examples of theend regions of the intra-gap segments which abut functionalintersections are end regions 213Y from which result gate extensions220A′, 220C′ and 220D′, and end regions 213Z from which result gateextensions 220A″, 220B″ and 220D″.

FIG. 3C is a more detailed view of block 320 of FIG. 3B, in accordancewith at least one embodiment of the present disclosure.

In FIG. 3C, block 320 includes a block 322. At block 322, the height ofthe first cut-patterns is chosen. In particular, the height of the firstcut-patterns is chosen such that the consequential height of the endregions H_(EXT) is less than or equal to about a three times multiple ofa width W_(G) in the first direction of the gate patterns, wherein:

H _(EXT)≤(≈3W _(G)).

FIG. 3D is a more detailed view of block 308 of FIG. 3A, in accordancewith at least one embodiment of the present disclosure.

In FIG. 3D, block 308 includes a block 330. At block 330, the width inthe horizontal direction the second cut-patterns is set. Each gatepattern and second cut-pattern has a corresponding width in the firstdirection. For corresponding ones of the end regions, the width of thesecond cut-patterns is to be a predetermined size which is greater thanthe width of corresponding gate patterns.

FIG. 3E is a more detailed view of block 330 of FIG. 3D, in accordancewith at least one embodiment of the present disclosure.

In FIG. 3E, block 330 includes a block 332. At block 332, the width ofthe second cut-patterns W_(CP2) is chosen to be less than or equal toabout a 12 times multiple of a width W_(G) of the gate patterns,wherein:

W _(CP2)≤(≈12W _(G))

FIG. 3F is another more detailed view of block 308 of FIG. 3A, inaccordance with at least one embodiment of the present disclosure.

In FIG. 3F, block 308 includes a block 340. At block 340, relative tothe first direction, the midlines of the second cut-patterns are alignedover centerlines of the corresponding gate patterns. Again, a centerlineof a structure is oriented parallel to the long axis of the structure.

FIG. 3G is a more detailed view of block 302 of FIG. 3A, in accordancewith at least one embodiment of the present disclosure.

In FIG. 3G, block 302 includes a block 350. At block 350, the ARpatterns are configured for finFET technology.

FIG. 4 is a block diagram of an electronic design automation (EDA)system 400, in accordance with at least one embodiment of the presentdisclosure.

In some embodiments, EDA system 400 includes an APR system. The methodof the flowcharts of FIGS. 3A-3G is implemented, for example, using EDAsystem 400, in accordance with some embodiments.

In some embodiments, EDA system 400 is a general purpose computingdevice including a hardware processor 402 and a non-transitory,computer-readable storage medium 404. Storage medium 404, amongst otherthings, is encoded with, i.e., stores, computer program code 406, i.e.,a set of executable instructions. Execution of instructions 406 byhardware processor 402 represents (at least in part) an EDA tool whichimplements a portion or all of, e.g., the methods of FIGS. 3A-3F, inaccordance with one or more embodiments (hereinafter, the notedprocesses and/or methods).

Processor 402 is electrically coupled to computer-readable storagemedium 404 via a bus 408. Processor 402 is also electrically coupled toan I/O interface 410 by bus 408. A network interface 412 is alsoelectrically connected to processor 402 via bus 408. Network interface412 is connected to a network 414, so that processor 402 andcomputer-readable storage medium 404 are capable of connecting toexternal elements via network 414. Processor 402 is configured toexecute computer program code 406 encoded in computer-readable storagemedium 404 in order to cause system 400 to be usable for performing aportion or all of the noted processes and/or methods. Computer-readablestorage medium 404 also includes one or more layouts 407 generatedaccording to a portion or all of the noted processes and/or methods. Inone or more embodiments, processor 402 is a central processing unit(CPU), a multi-processor, a distributed processing system, anapplication specific integrated circuit (ASIC), and/or a suitableprocessing unit.

In one or more embodiments, computer-readable storage medium 404 is anelectronic, magnetic, optical, electromagnetic, infrared, and/or asemiconductor system (or apparatus or device). For example,computer-readable storage medium 404 includes a semiconductor orsolid-state memory, a magnetic tape, a removable computer diskette, arandom access memory (RAM), a read-only memory (ROM), a rigid magneticdisk, and/or an optical disk. In one or more embodiments using opticaldisks, computer-readable storage medium 404 includes a compact disk-readonly memory (CD-ROM), a compact disk-read/write (CD-R/W), and/or adigital video disc (DVD).

In one or more embodiments, storage medium 404 stores computer programcode 406 configured to cause system 400 (where such execution represents(at least in part) the EDA tool) to be usable for performing a portionor all of the noted processes and/or methods. In one or moreembodiments, storage medium 404 also stores information whichfacilitates performing a portion or all of the noted processes and/ormethods. In one or more embodiments, storage medium 404 stores a library(not shown) of standard cells.

EDA system 400 includes I/O interface 410. I/O interface 410 is coupledto external circuitry. In one or more embodiments, I/O interface 410includes a keyboard, keypad, mouse, trackball, trackpad, touchscreen,and/or cursor direction keys for communicating information and commandsto processor 402.

Again, EDA system 400 includes network interface 412. Network interface412 includes wireless network interfaces such as BLUETOOTH, WIFI, WIMAX,GPRS, or WCDMA; or wired network interfaces such as ETHERNET, USB, orIEEE-1364. In one or more embodiments, a portion or all of notedprocesses and/or methods, is implemented in two or more systems 400.

System 400 is configured to receive information through I/O interface410. The information received through I/O interface 410 includes one ormore of instructions, data, design rules, libraries of standard cells,and/or other parameters for processing by processor 402. The informationis transferred to processor 402 via bus 408. EDA system 400 isconfigured to receive information related to a UI through I/O interface410. The information is stored in computer-readable medium 404 as userinterface (UI) 442.

In some embodiments, a portion or all of the noted processes and/ormethods is implemented as a standalone software application forexecution by a processor. In some embodiments, a portion or all of thenoted processes and/or methods is implemented as a software applicationthat is a part of an additional software application. In someembodiments, a portion or all of the noted processes and/or methods isimplemented as a plug-in to a software application. In some embodiments,at least one of the noted processes and/or methods is implemented as asoftware application that is a portion of an EDA tool. In someembodiments, a portion or all of the noted processes and/or methods isimplemented as a software application that is used by EDA system 400. Insome embodiments, a layout is generated using a tool such as VIRTUOSO®available from CADENCE DESIGN SYSTEMS, Inc., or another suitable layoutgenerating tool.

In some embodiments, the processes are realized as functions of aprogram stored in a non-transitory computer readable recording medium.Examples of a non-transitory computer readable recording medium include,but are not limited to, external/removable and/or internal/built-instorage or memory unit, e.g., one or more of an optical disk, such as aDVD, a magnetic disk, such as a hard disk, a semiconductor memory, suchas a ROM, a RAM, a memory card, and the like.

FIG. 5 is a block diagram of an integrated circuit (IC) manufacturingsystem 500, and an IC manufacturing flow associated therewith, inaccordance with at least one embodiment of the present disclosure.

In FIG. 5, IC manufacturing system 500 includes entities, such as adesign house 520, a mask house 530, and an IC manufacturer/fabricator(“fab”) 550, that interact with one another in the design, development,and manufacturing cycles and/or services related to manufacturing an ICdevice 560. The entities in system 500 are connected by a communicationsnetwork. In some embodiments, the communications network is a singlenetwork. In some embodiments, the communications network is a variety ofdifferent networks, such as an intranet and the Internet. Thecommunications network includes wired and/or wireless communicationchannels. Each entity interacts with one or more of the other entitiesand provides services to and/or receives services from one or more ofthe other entities. In some embodiments, two or more of design house520, mask house 530, and IC fab 550 is owned by a single larger company.In some embodiments, two or more of design house 520, mask house 530,and IC fab 550 coexist in a common facility and use common resources.

Design house (or design team) 520 generates an IC design layout 522. ICdesign layout 522 includes various geometrical patterns designed for anIC device 560. The geometrical patterns correspond to patterns of metal,oxide, or semiconductor layers that make up the various components of ICdevice 560 to be fabricated. The various layers combine to form variousIC features. For example, a portion of IC design layout 522 includesvarious IC features, such as an active region, gate electrode, sourceand drain, metal lines or vias of an interlayer interconnection, andopenings for bonding pads, to be formed in a semiconductor substrate(such as a silicon wafer) and various material layers disposed on thesemiconductor substrate. Design house 520 implements a proper designprocedure to form IC design layout 522. The design procedure includesone or more of logic design, physical design or place and route. ICdesign layout 522 is presented in one or more data files havinginformation of the geometrical patterns. For example, IC design layout522 can be expressed in a GDSII file format or DFII file format.

Mask house 530 includes data preparation 532 and mask fabrication 544.Mask house 530 uses IC design layout 522 to manufacture one or moremasks to be used for fabricating the various layers of IC device 560according to IC design layout 522. Mask house 530 performs mask datapreparation 532, where IC design layout 522 is translated into arepresentative data file (“RDF”). Mask data preparation 532 provides theRDF to mask fabrication 544. Mask fabrication 544 includes a maskwriter. A mask writer converts the RDF to an image on a substrate, suchas a mask (reticle) or a semiconductor wafer. The design layout ismanipulated by mask data preparation 532 to comply with particularcharacteristics of the mask writer and/or requirements of IC fab 550. InFIG. 5, mask data preparation 532 and mask fabrication 544 areillustrated as separate elements. In some embodiments, mask datapreparation 532 and mask fabrication 544 can be collectively referred toas mask data preparation.

In some embodiments, mask data preparation 532 includes opticalproximity correction (OPC) which uses lithography enhancement techniquesto compensate for image errors, such as those that can arise fromdiffraction, interference, other process effects and the like. OPCadjusts IC design layout 522. In some embodiments, mask data preparation532 includes further resolution enhancement techniques (RET), such asoff-axis illumination, sub-resolution assist features, phase-shiftingmasks, other suitable techniques, and the like or combinations thereof.In some embodiments, inverse lithography technology (ILT) is also used,which treats OPC as an inverse imaging problem.

In some embodiments, mask data preparation 532 includes a mask rulechecker (MRC) that checks the IC design layout that has undergoneprocesses in OPC with a set of mask creation rules which contain certaingeometric and/or connectivity restrictions to ensure sufficient margins,to account for variability in semiconductor manufacturing processes, andthe like. In some embodiments, the MRC modifies the IC design layout tocompensate for limitations during mask fabrication 544, which may undopart of the modifications performed by OPC in order to meet maskcreation rules.

In some embodiments, mask data preparation 532 includes lithographyprocess checking (LPC) that simulates processing that will beimplemented by IC fab 550 to fabricate IC device 560. LPC simulates thisprocessing based on IC design layout 522 to create a simulatedmanufactured device, such as IC device 560. The processing parameters inLPC simulation can include parameters associated with various processesof the IC manufacturing cycle, parameters associated with tools used formanufacturing the IC, and/or other aspects of the manufacturing process.LPC takes into account various factors, such as aerial image contrast,depth of focus (“DOF”), mask error enhancement factor (“MEEF”), othersuitable factors, and the like or combinations thereof. In someembodiments, after a simulated manufactured device has been created byLPC, if the simulated device is not close enough in shape to satisfydesign rules, OPC and/or MRC are be repeated to further refine IC designlayout 522.

It should be understood that the above description of mask datapreparation 532 has been simplified for the purposes of clarity. In someembodiments, data preparation 532 includes additional features such as alogic operation (LOP) to modify the IC design layout according tomanufacturing rules. Additionally, the processes applied to IC designlayout 522 during data preparation 532 may be executed in a variety ofdifferent orders.

After mask data preparation 532 and during mask fabrication 544, a maskor a group of masks are fabricated based on the modified IC designlayout. In some embodiments, an electron-beam (e-beam) or a mechanism ofmultiple e-beams is used to form a pattern on a mask (photomask orreticle) based on the modified IC design layout. The mask can be formedin various technologies. In some embodiments, the mask is formed usingbinary technology. In some embodiments, a mask pattern includes opaqueregions and transparent regions. A radiation beam, such as anultraviolet (UV) beam, used to expose the image sensitive material layer(e.g., photoresist) which has been coated on a wafer, is blocked by theopaque region and transmits through the transparent regions. In oneexample, a binary mask includes a transparent substrate (e.g., fusedquartz) and an opaque material (e.g., chromium) coated in the opaqueregions of the mask. In another example, the mask is formed using aphase shift technology. In the phase shift mask (PSM), various featuresin the pattern formed on the mask are configured to have proper phasedifference to enhance the resolution and imaging quality. In variousexamples, the phase shift mask can be attenuated PSM or alternating PSM.The mask(s) generated by mask fabrication 544 is used in a variety ofprocesses. For example, such a mask(s) is used in an ion implantationprocess to form various doped regions in the semiconductor wafer, in anetching process to form various etching regions in the semiconductorwafer, and/or in other suitable processes.

IC fab 550 is an IC fabrication business that includes one or moremanufacturing facilities for the fabrication of a variety of differentIC products. In some embodiments, IC Fab 550 is a semiconductor foundry.For example, there may be a manufacturing facility for the front endfabrication of a plurality of IC products (front-end-of-line (FEOL)fabrication), while a second manufacturing facility may provide the backend fabrication for the interconnection and packaging of the IC products(back-end-of-line (BEOL) fabrication), and a third manufacturingfacility may provide other services for the foundry business.

IC fab 550 uses the mask (or masks) fabricated by mask house 530 tofabricate IC device 560. Thus, IC fab 550 at least indirectly uses ICdesign layout 522 to fabricate IC device 560. In some embodiments, asemiconductor wafer 552 is fabricated by IC fab 550 using the mask (ormasks) to form IC device 560. Semiconductor wafer 55 includes a siliconsubstrate or other proper substrate having material layers formedthereon. Semiconductor wafer further includes one or more of variousdoped regions, dielectric features, multilevel interconnects, and thelike (formed at subsequent manufacturing steps).

Details regarding an integrated circuit (IC) manufacturing system (e.g.,system 500 of FIG. 5), and an IC manufacturing flow associated therewithare found, e.g., in U.S. Pat. No. 9,256,709, granted Feb. 9, 2016, U.S.Pre-Grant Publication No. 20150278429, published Oct. 1, 2015, U.S.Pre-Grant Publication No. 20140040838, published Feb. 6, 2014, and U.S.Pat. No. 7,260,442, granted Aug. 21, 2007, the entireties of each ofwhich are hereby incorporated by reference.

In an embodiment, a method (of manufacturing a semiconductor device)includes: forming active regions oriented parallel to a first direction,the forming active regions including spacing apart neighboring ones ofthe active regions resulting in corresponding gaps therebetween; forminggate structures overlying corresponding ones of the active regions andthe gaps and being oriented parallel to a second direction, the seconddirection being orthogonal to the first direction, the forming gatestructures including locating intra-gap segments of the gate structurescorrespondingly over the gaps, arranging each intra-gap segment toinclude two end regions separated by a central region, and at anintersection between a corresponding one of the active regions and acorresponding one of the gate structures that is designated to benon-functional (flyover intersection), preventing formation of afunctional connection between the corresponding one of the activeregions and the corresponding one of the gate structures; and removingselected portions of at least some of the intra-gap segments includingremoving central regions of first selected ones of intra-gap segmentssubstantially without removing portions of corresponding end regions ofthe first selected ones of intra-gap segments, and removing centralregions and portions of corresponding end regions of second selectedones of intra-gap segments for which the corresponding end regions ofthe second selected ones of intra-gap segments abut correspondingflyover intersections thereby trimming corresponding gate structures.

In an embodiment, the forming active regions further includes: formingat least one component of a semiconductor integrated circuit (IC) in acorresponding at least one of the active regions. In an embodiment, theforming gate structures further includes: at an intersection between acorresponding one of the active regions and a corresponding one of thegate structures that is designated to be functional (functionalintersection), making a functional connection between the correspondingone of the active regions and the corresponding one of the gatestructures. In an embodiment, each of the end regions extends acorresponding overhang distance in the second direction from acorresponding one of the active regions towards a corresponding one ofthe central regions; the first selected ones of intra-gap segments abutcorresponding functional intersections; and for each end region of thefirst selected ones of intra-gap segments, the corresponding overhangdistance is approximately equal to a predetermined value whichfacilitates the making a functional connection between the correspondingone of the active regions and the corresponding one of the gatestructures. In an embodiment, each of the gate structures hassubstantially a same width in the first direction; and the predeterminedvalue is less than or equal to about a three times multiple of the widthof the gate structures. In an embodiment, each of the gate structureshas substantially a same width in the first direction; and thepredetermined value is greater than of the width of the gate structures.In an embodiment, the method further includes: over locations formerlycorresponding to the central regions of the first selected one of theintra-gap segments, forming one or more metal lines in one or morecorresponding metallization layers. In an embodiment, at least some ofthe one or more metal lines represent portions of a power grid.

In an embodiment, a method (of manufacturing a semiconductor device)includes: forming active regions that extend in a first direction, theforming active regions including spacing apart neighboring ones of theactive regions resulting in corresponding gaps therebetween; forminggate structures overlying corresponding ones of the active regions andthe gaps and being oriented parallel to a second direction, the seconddirection being orthogonal to the first direction, the forming gatestructures including locating intra-gap segments of the gate structurescorrespondingly over the gaps; arranging each intra-gap segment toinclude two end regions separated by a central region; and at anintersection between a corresponding one of the active regions and acorresponding one of the gate structures that is designated to benon-functional (flyover intersection), preventing formation of afunctional connection between the corresponding one of the activeregions and the corresponding one of the gate structures; at anintersection between a corresponding one of the active regions and acorresponding one of the gate structures that is designated to befunctional (functional intersection), making a functional connectionbetween the corresponding one of the active regions and thecorresponding one of the gate structures; and removing selected portionsof at least some of the intra-gap segments including removing centralregions of first selected ones of the intra-gap segments for whichcorresponding end regions abut functional intersections substantiallywithout removing portions of corresponding end regions of the firstselected ones of intra-gap segments, and removing central regions andportions of corresponding end regions of second selected ones of theintra-gap segments for which the corresponding end regions of the secondselected ones of intra-gap segments abut flyover intersections.

In an embodiment, the forming active regions further includes: formingat least one component of a semiconductor integrated circuit in acorresponding at least one of the active regions. In an embodiment, eachof the end regions extends a corresponding overhang distance in thesecond direction from a corresponding one of the active regions towardsa corresponding one of the central regions; the first selected ones ofintra-gap segments abut corresponding functional intersections; and foreach end region of the first selected ones of intra-gap segments, thecorresponding overhang distance is approximately equal to apredetermined value which facilitates the making a functional connectionbetween the corresponding one of the active regions and thecorresponding one of the gate structures. In an embodiment, each of thegate structures has substantially a same width in the first direction;and the predetermined value is greater than of the width of the gatestructures. In an embodiment, each of the gate structures hassubstantially a same width in the first direction; and the predeterminedvalue is less than or equal to about a three times multiple of the widthof the gate structures. In an embodiment, the method further includes:over locations formerly corresponding to the central regions of thefirst selected one of the intra-gap segments, forming one or more metallines in one or more corresponding metallization layers. In anembodiment, at least some of the one or more metal lines representportions of a power grid. In an embodiment, the removing central regionsand portions of corresponding end regions of second selected ones of theintra-gap segments for which the corresponding end regions abut flyoverintersections substantially completely removes the corresponding endregions so that the corresponding gate structures do not extendsubstantially into the corresponding gaps.

In an embodiment, a method (of manufacturing a semiconductor device)includes: forming active regions oriented parallel to a first direction,the forming active regions including spacing apart neighboring ones ofthe active regions resulting in corresponding gaps therebetween, andforming at least one component of a semiconductor integrated circuit(IC) in a corresponding at least one of the active regions; forming gatestructures overlying corresponding ones of the active regions and thegaps and being oriented parallel to a second direction, the seconddirection being orthogonal to the first direction, the forming gatestructures including locating intra-gap segments of the gate structurescorrespondingly over the gaps, arranging each intra-gap segment toinclude two end regions separated by a central region, and at anintersection between a corresponding one of the active regions and acorresponding one of the gate structures that is designated to benon-functional (flyover intersection), preventing formation of afunctional connection between the corresponding one of the activeregions and the corresponding one of the gate structures; removingselected portions of at least some of the intra-gap segments includingremoving central regions of first selected ones of intra-gap segmentssubstantially without removing portions of corresponding end regions ofthe first selected ones of intra-gap segments, and removing centralregions and portions of corresponding end regions of second selectedones of intra-gap segments for which the corresponding end regions ofthe second selected ones of intra-gap segments abut correspondingflyover intersections; and over locations formerly corresponding to thecentral regions of the first selected one of the intra-gap segments,forming one or more metal lines in one or more correspondingmetallization layers.

In an embodiment, the forming gate structures further includes: at anintersection between a corresponding one of the active regions and acorresponding one of the gate structures that is designated to befunctional (functional intersection), making a functional connectionbetween the corresponding one of the active regions and thecorresponding one of the gate structures. In an embodiment, each of theend regions extends a corresponding overhang distance in the seconddirection from a corresponding one of the active regions towards acorresponding one of the central regions; the first selected ones ofintra-gap segments abut corresponding functional intersections; each ofthe gate structures has substantially a same width in the firstdirection; and for each end region of the first selected ones ofintra-gap segments, the corresponding overhang distance is approximatelyequal to a predetermined value which facilitates the making a functionalconnection between the corresponding one of the active regions and thecorresponding one of the gate structures, the predetermined value beinggreater than of the width of the gate structures and less than or equalto about a three times multiple of the width of the gate structures. Inan embodiment, at least some of the one or more metal lines representportions of a power grid.

It will be readily seen by one of ordinary skill in the art that one ormore of the disclosed embodiments fulfill one or more of the advantagesset forth above. After reading the foregoing specification, one ofordinary skill will be able to affect various changes, substitutions ofequivalents and various other embodiments as broadly disclosed herein.It is therefore intended that the protection granted hereon be limitedonly by the definition contained in the appended claims and equivalentsthereof.

What is claimed is:
 1. A method of manufacturing a semiconductor device,the method comprising: forming active regions oriented parallel to afirst direction, the forming active regions including: spacing apartneighboring ones of the active regions resulting in corresponding gapstherebetween; forming gate structures overlying corresponding ones ofthe active regions and the gaps and being oriented parallel to a seconddirection, the second direction being orthogonal to the first direction,the forming gate structures including: locating intra-gap segments ofthe gate structures correspondingly over the gaps; arranging eachintra-gap segment to include two end regions separated by a centralregion; and at an intersection between a corresponding one of the activeregions and a corresponding one of the gate structures that isdesignated to be non-functional (flyover intersection), preventingformation of a functional connection between the corresponding one ofthe active regions and the corresponding one of the gate structures; andremoving selected portions of at least some of the intra-gap segmentsincluding: removing central regions of first selected ones of intra-gapsegments substantially without removing portions of corresponding endregions of the first selected ones of intra-gap segments; and removingcentral regions and portions of corresponding end regions of secondselected ones of intra-gap segments for which the corresponding endregions of the second selected ones of intra-gap segments abutcorresponding flyover intersections thereby trimming corresponding gatestructures.
 2. The method of claim 1, wherein the forming active regionsfurther includes: forming at least one component of a semiconductorintegrated circuit (IC) in a corresponding at least one of the activeregions.
 3. The method of claim 1, wherein the forming gate structuresfurther includes: at an intersection between a corresponding one of theactive regions and a corresponding one of the gate structures that isdesignated to be functional (functional intersection), making afunctional connection between the corresponding one of the activeregions and the corresponding one of the gate structures.
 4. The methodof claim 3, wherein: each of the end regions extends a correspondingoverhang distance in the second direction from a corresponding one ofthe active regions towards a corresponding one of the central regions;the first selected ones of intra-gap segments abut correspondingfunctional intersections; and for each end region of the first selectedones of intra-gap segments, the corresponding overhang distance isapproximately equal to a predetermined value which facilitates themaking a functional connection between the corresponding one of theactive regions and the corresponding one of the gate structures.
 5. Themethod of claim 4, wherein: each of the gate structures hassubstantially a same width in the first direction; and the predeterminedvalue is less than or equal to about a three times multiple of the widthof the gate structures.
 6. The method of claim 4, wherein: each of thegate structures has substantially a same width in the first direction;and the predetermined value is greater than of the width of the gatestructures.
 7. The method of claim 6, further comprising: over locationsformerly corresponding to the central regions of the first selected oneof the intra-gap segments, forming one or more metal lines in one ormore corresponding metallization layers.
 8. The method of claim 7,wherein: at least some of the one or more metal lines represent portionsof a power grid.
 9. A method of manufacturing a semiconductor device,the method comprising: forming active regions that extend in a firstdirection, the forming active regions including: spacing apartneighboring ones of the active regions resulting in corresponding gapstherebetween; forming gate structures overlying corresponding ones ofthe active regions and the gaps and being oriented parallel to a seconddirection, the second direction being orthogonal to the first direction,the forming gate structures including; locating intra-gap segments ofthe gate structures correspondingly over the gaps; arranging eachintra-gap segment to include two end regions separated by a centralregion; and at an intersection between a corresponding one of the activeregions and a corresponding one of the gate structures that isdesignated to be non-functional (flyover intersection), preventingformation of a functional connection between the corresponding one ofthe active regions and the corresponding one of the gate structures; atan intersection between a corresponding one of the active regions and acorresponding one of the gate structures that is designated to befunctional (functional intersection), making a functional connectionbetween the corresponding one of the active regions and thecorresponding one of the gate structures; and removing selected portionsof at least some of the intra-gap segments including: removing centralregions of first selected ones of the intra-gap segments for whichcorresponding end regions abut functional intersections substantiallywithout removing portions of corresponding end regions of the firstselected ones of intra-gap segments; and removing central regions andportions of corresponding end regions of second selected ones of theintra-gap segments for which the corresponding end regions of the secondselected ones of intra-gap segments abut flyover intersections.
 10. Themethod of claim 9, wherein the forming active regions further includes:forming at least one component of a semiconductor integrated circuit ina corresponding at least one of the active regions.
 11. The method ofclaim 9, wherein: each of the end regions extends a correspondingoverhang distance in the second direction from a corresponding one ofthe active regions towards a corresponding one of the central regions;the first selected ones of intra-gap segments abut correspondingfunctional intersections; and for each end region of the first selectedones of intra-gap segments, the corresponding overhang distance isapproximately equal to a predetermined value which facilitates themaking a functional connection between the corresponding one of theactive regions and the corresponding one of the gate structures.
 12. Themethod of claim 11, wherein: each of the gate structures hassubstantially a same width in the first direction; and the predeterminedvalue is greater than of the width of the gate structures.
 13. Themethod of claim 11, wherein: each of the gate structures hassubstantially a same width in the first direction; and the predeterminedvalue is less than or equal to about a three times multiple of the widthof the gate structures.
 14. The method of claim 9, further comprising:over locations formerly corresponding to the central regions of thefirst selected one of the intra-gap segments, forming one or more metallines in one or more corresponding metallization layers.
 15. The methodof claim 14, wherein: at least some of the one or more metal linesrepresent portions of a power grid.
 16. The method of claim 9, wherein:the removing central regions and portions of corresponding end regionsof second selected ones of the intra-gap segments for which thecorresponding end regions abut flyover intersections substantiallycompletely removes the corresponding end regions so that thecorresponding gate structures do not extend substantially into thecorresponding gaps.
 17. A method of manufacturing a semiconductordevice, the method comprising: forming active regions oriented parallelto a first direction, the forming active regions including: spacingapart neighboring ones of the active regions resulting in correspondinggaps therebetween; and forming at least one component of a semiconductorintegrated circuit (IC) in a corresponding at least one of the activeregions; forming gate structures overlying corresponding ones of theactive regions and the gaps and being oriented parallel to a seconddirection, the second direction being orthogonal to the first direction,the forming gate structures including: locating intra-gap segments ofthe gate structures correspondingly over the gaps; arranging eachintra-gap segment to include two end regions separated by a centralregion; and at an intersection between a corresponding one of the activeregions and a corresponding one of the gate structures that isdesignated to be non-functional (flyover intersection), preventingformation of a functional connection between the corresponding one ofthe active regions and the corresponding one of the gate structures;removing selected portions of at least some of the intra-gap segmentsincluding: removing central regions of first selected ones of intra-gapsegments substantially without removing portions of corresponding endregions of the first selected ones of intra-gap segments; and removingcentral regions and portions of corresponding end regions of secondselected ones of intra-gap segments for which the corresponding endregions of the second selected ones of intra-gap segments abutcorresponding flyover intersections; and over locations formerlycorresponding to the central regions of the first selected one of theintra-gap segments, forming one or more metal lines in one or morecorresponding metallization layers.
 18. The method of claim 17, whereinthe forming gate structures further includes: at an intersection betweena corresponding one of the active regions and a corresponding one of thegate structures that is designated to be functional (functionalintersection), making a functional connection between the correspondingone of the active regions and the corresponding one of the gatestructures.
 19. The method of claim 17, wherein: each of the end regionsextends a corresponding overhang distance in the second direction from acorresponding one of the active regions towards a corresponding one ofthe central regions; the first selected ones of intra-gap segments abutcorresponding functional intersections; each of the gate structures hassubstantially a same width in the first direction; and for each endregion of the first selected ones of intra-gap segments, thecorresponding overhang distance is approximately equal to apredetermined value which facilitates the making a functional connectionbetween the corresponding one of the active regions and thecorresponding one of the gate structures, the predetermined value beinggreater than of the width of the gate structures and less than or equalto about a three times multiple of the width of the gate structures. 20.The method of claim 17, wherein: at least some of the one or more metallines represent portions of a power grid.